质量政策
Quality to meet customer’s satisfaction with continuous improvement and innovation.
Quality system certification
ISO 9001 certificate from UL (2007)
Quality system certification
ISO 9001 certificate from UL (2007)
可靠度与失效分析
Reliability Test
Reliability tests at inergy can be divided into two categories .Reliability is applied to qualify packages, products and also to monitor the stability of the manufacturing process. Reliability testing results are analyzed for further circuit or Package improvement.
Reliability Test Item
inergy follows the JESD22 series of standards for package reliability testing.
Resistance to ESD, latch-up and lifetime are evalsuated in all in products.
| Qualification Test | Method | Description | Sample size |
|---|---|---|---|
High temp. operating life test (HOLT) |
MIL-STD-883-1005 |
1000 Hrs Bias @ 125℃ |
77 |
Temperature cycling test (TCT) |
MIL-STD-883-1010 |
-65℃ ~ 150℃, 200Cys |
77 |
Pressure cook test (PCT) |
JESD22-A102 |
121℃,100%RH,2atm,168Hrs |
77 |
Power cycling test(P/C) |
MIL-STD-750-1006 |
10000Cys Bias @ △100℃ |
45 |
High Temperature Gate Bias (HTGB) |
MIL-STD-750-1039 |
1000 Hrs @ 150℃ |
45 |
High Temperature Reverse Bias (HTRB) |
MIL-STD-750-1039 |
1000 Hrs @ 150℃ |
45 |
ESD |
MIL-STD-883-3015 |
VHBM >2KV, VMM >200V |
3 |
Latch-Up |
MIL-STD-883-1020 |
10ms , Itr > 100mA |
3 |
Marking Traceability
The top of each inergy product is marked with our coding system.
The picture below shows a sample of our IC code.
It is crucial to non-conforming parts control and quality control tracking. Production history can be traced effectively and efficiently by a single IC. Smaller ICs, like SOT-2X and DFN, are marked with a serial number.
Please contact our account manager for details on our coding system.
Failure Analysis Capability
Failure analysis traces back the failure results of a device, part or component. It plays an important role in product quality. Effective improvement or preventive measures are based on accurate failure analysis results. Information collection, proper sample handling, proper analysis procedures, experience, historical database review and most importantly, logical judgment are key to accurate failure analysis.
Failure samples come from customer feedback, reliability tests, qualification failures, engineering experiments and low yield parts. The experienced lab provide tool analysis services:
MA-tek: Material Analysis Technology Inc.
This lab provide chemical analysis services like de-capsulation, lay removal, etching for sample preparation, electrical analysis, emission microscopy, liquid crystal microscopy, OBIRCH, probing, SEM, TEM inspection and FIB for circuit repair.
Generic failure analysis procedure:
绿色产品
Green Commitment
As a responsible global citizen, inergy is committed to protecting our environment by becoming a Green supplier. We began this effort by converting our products to be Green compliant starting in September 2008 and achieving full Green conversion in January 2009.
All inergy products and materials are RoHS compliant. Our Products are also available in halogen free options upon request.
Green
inergy defines Green as products that are RoHS compliant and use flame retardant agents in the molding compound that do not exceed the following hazardous materials levels:
| Item | Banned Substance | Directive / Standard & Max.Limit | Test Results | |
|---|---|---|---|---|
| Pb-Free Product(RoHS Compliant) | Green Product | |||
| 1 | Cadmium (Cd) |
RoHS Directive (2002/95/EC) <100ppm |
Acceptable |
Acceptable |
| 2 | Lead (Pb)* |
RoHS Directive (2002/95/EC) <1000ppm |
Acceptable |
Acceptable |
| 3 | Mercury (Hg) |
|||
| 4 | Hexavalent Chromium (Cr 6+) |
|||
| 5 | Polybrominated Biphenyls (PBBs) |
|||
| 6 | Polybrominated Biphenyl Ethers (PBDEs) |
|||
| 7 | PFOS |
RoHS Directive (2006/122/EC) <1000ppm |
||
| 8 | Halogens- Fluorine (F), Chlorine (Cl), Bromine (Br), Iodine (I) |
IEC 61249-2-21 Cl<900 ppm Br<900ppm Total halogens contained<1500ppm |
Not Acceptable (>1000ppm) |
Acceptable |
* Maximum Pb limit does not apply to applications for which exemptions have been granted by the RoHS Directive, such as high temperature solder die attach for certain products.
Soldering Flow Profile
Inergy “Lead-free & Green” products with 100% pure Tin(100% matte Sn ) Refer to IPC/JEDEC J-STD-020C specification.
Pb-free Process – Package Classification Reflow Temperatures
| Package Thickness | Volume mm3 <350 | Volume mm3 350-2000 | Volume mm3 >2000 |
|---|---|---|---|
| <1.6 mm | 260 +0°C* | 260 +0°C* | 260 +0°C* |
| 1.6 mm – 2.5 mm | 260 +0°C* | 250 +0°C* | 245 +0°C* |
| ³2 ≧2.5mm | 250 +0°C* | 245 +0°C* | 245 +0°C* |
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level.
Pb-Free Assembly Profile Feature
- Average ramp-up rate (TL to TP)：3°C/second max.
- Preheat
-Temperature Min (Tsmin)：150°C
-Temperature Max (Tsmax) ：200°C
-Time (min to max) (ts)：60-180 seconds - Time maintained above
-Temperature (TL)：217°C
-Time (tL)：60-150 seconds - Peak/Classification Temperature (Tp) ：See Pb-free Process
- Time within 5°C of actual Peak Temperature (tp) ：20-40 seconds
- Ramp-down Rate ：6°C/second max.
- Time 25°C to Peak Temperature：8 minutes max.
